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Assembly and Reliability of Lead-Free Solder Joints
John H Lau, Ning-Cheng Lee
Livre broché | Anglais
198,45 €
+ 396 points
Description
This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products.
Spécifications
Parties prenantes
- Auteur(s) :
- Editeur:
Contenu
- Nombre de pages :
- 527
- Langue:
- Anglais
Caractéristiques
- EAN:
- 9789811539220
- Date de parution :
- 30-05-21
- Format:
- Livre broché
- Format numérique:
- Trade paperback (VS)
- Dimensions :
- 203 mm x 234 mm
- Poids :
- 907 g
Seulement chez Librairie Club
+ 396 points sur votre carte client de Librairie Club
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