Description

In a field where change and growth is inevitable, new electronic packaging problems continually arise. Smaller, more powerful devices are prone to overheating, causing a variety of problems. Thermal Design of Electronic Equipment specifically targets the formulas used by electronic packaging and thermal engineers. It presents heat transfer equations dealing with polyalphaolephin, silicone oils, perfluorocarbons, and silicate ester-based liquids. Instead of relying on theoretical expressions and text explanations, the author presents empirical formulas and practical techniques that allow you to quickly solve nearly any thermal engineering problem in electronic packaging.

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